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Rotary coding for power reduction and S/N improvement in inductive-coupling data communication., , , и . A-SSCC, стр. 205-208. IEEE, (2011)A 12.5Gb/s/link non-contact multi drop bus system with impedance-matched transmission line couplers and Dicode partial-response channel transceivers., , , , , и . CICC, стр. 1-4. IEEE, (2012)A 500 MHz-BW -52.5 dB-THD Voltage-to-Time Converter Utilizing Two-Step Transition Inverter Delay Lines in 28 nm CMOS., , , , и . IEICE Trans. Electron., 100-C (6): 560-567 (2017)Simultaneous 6-Gb/s Data and 10-mW Power Transmission Using Nested Clover Coils for Noncontact Memory Card., , , , , , и . IEEE J. Solid State Circuits, 47 (10): 2484-2495 (2012)A 12-Gb/s Non-Contact Interface With Coupled Transmission Lines., , , , , и . IEEE J. Solid State Circuits, 48 (3): 790-800 (2013)Design Methodology and Validity Verification for a Reactive Countermeasure Against EM Attacks., , , , , и . J. Cryptol., 30 (2): 373-391 (2017)A 7Gb/s/link non-contact memory module for multi-drop bus system using energy-equipartitioned coupled transmission line., , , , , , и . ISSCC, стр. 52-54. IEEE, (2012)A 195-gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package., , , , и . IEEE J. Solid State Circuits, 41 (1): 23-34 (2006)Si-Backside Protection Circuits Against Physical Security Attacks on Flip-Chip Devices., , , , , , , , и . IEEE J. Solid State Circuits, 55 (10): 2747-2755 (2020)A Scalable 3D Heterogeneous Multicore with an Inductive ThruChip Interface., , , , , , , , , и 1 other автор(ы). IEEE Micro, 33 (6): 6-15 (2013)