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High Density Embedded 3D Stackable Via RRAM in Advanced MCU Applications.

, , , , , , , and . VLSI Technology and Circuits, page 1-2. IEEE, (2023)

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Reliability Analysis of Physically Unclonable Function by Using Aging Variability Simulation., , , , , , and . IRPS, page 1. IEEE, (2022)RIFLE: An Architectural Framework for User-Centric Information-Flow Security., , , , , , , , and . MICRO, page 243-254. IEEE Computer Society, (2004)13.5 A 16nm 128Mb SRAM in high-κ metal-gate FinFET technology with write-assist circuitry for low-VMIN applications., , , , , , , , , and 4 other author(s). ISSCC, page 238-239. IEEE, (2014)Design and Evaluation of Hybrid Fault-Detection Systems., , , , , and . ISCA, page 148-159. IEEE Computer Society, (2005)A Reliable, Low-Cost, Low-Energy Physically Unclonable Function Circuit Through Effective Filtering., , , , , and . VLSI-DAT, page 1-4. IEEE, (2019)A 64-Kb 0.37V 28nm 10T-SRAM with mixed-Vth read-port and boosted WL scheme for IoT applications., , , , , , , and . A-SSCC, page 185-188. IEEE, (2016)Power reduction techniques for an 8-core xeon® processor., , , , , , , , , and . ESSCIRC, page 340-343. IEEE, (2009)High Density Embedded 3D Stackable Via RRAM in Advanced MCU Applications., , , , , , , and . VLSI Technology and Circuits, page 1-2. IEEE, (2023)ePluribus: Ethnicity on Social Networks., , , and . ICWSM, The AAAI Press, (2010)15.3 A 351TOPS/W and 372.4GOPS Compute-in-Memory SRAM Macro in 7nm FinFET CMOS for Machine-Learning Applications., , , , , , , and . ISSCC, page 242-244. IEEE, (2020)