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BeGAN: Power Grid Benchmark Generation Using a Process-portable GAN-based Methodology.

, , , and . ICCAD, page 1-8. IEEE, (2021)

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Encoder-Decoder Networks for Analyzing Thermal and Power Delivery Networks., , , , , and . ACM Trans. Design Autom. Electr. Syst., 28 (1): 3:1-3:27 (January 2023)Toward an Open-Source Digital Flow: First Learnings from the OpenROAD Project., , , , , , , , , and 11 other author(s). DAC, page 76. ACM, (2019)Impact of Self-heating on Performance and Reliability in FinFET and GAAFET Designs., and . ISQED, page 235-240. IEEE, (2019)ECO-CHIP: Estimation of Carbon Footprint of Chiplet-based Architectures for Sustainable VLSI., , , , and . HPCA, page 671-685. IEEE, (2024)A New, Computationally Efficient "Blech Criterion" for Immortality in General Interconnects., , and . DAC, page 913-918. IEEE, (2021)Invited Paper: 2023 ICCAD CAD Contest Problem C: Static IR Drop Estimation Using Machine Learning., and . ICCAD, page 1-5. IEEE, (2023)Invited Paper: CircuitOps: An ML Infrastructure Enabling Generative AI for VLSI Circuit Optimization., , , , and . ICCAD, page 1-6. IEEE, (2023)BeGAN: Power Grid Benchmark Generation Using a Process-portable GAN-based Methodology., , , and . ICCAD, page 1-8. IEEE, (2021)XT-PRAGGMA: Crosstalk Pessimism Reduction Achieved with GPU Gate-level Simulations and Machine Learning., , , , , , and . MLCAD, page 63-69. ACM / IEEE, (2022)Benchmarking Heterogeneous Integration with 2.5D/3D Interconnect Modeling., , , , , , , , and . ASICON, page 1-4. IEEE, (2023)