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Optimization of the write algorithm at low-current (10μA) in Cu/Al2O3-based conductive-bridge RAM.

, , , , , and . ESSDERC, page 114-117. IEEE, (2015)

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Engineering of a TiN\Al2O3\(Hf, Al)O2\Ta2O5\Hf RRAM cell for fast operation at low current., , , , , , and . ESSDERC, page 262-265. IEEE, (2015)3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps., , , , , , , , , and 9 other author(s). ICICDT, page 1-4. IEEE, (2012)Optimization of the write algorithm at low-current (10μA) in Cu/Al2O3-based conductive-bridge RAM., , , , , and . ESSDERC, page 114-117. IEEE, (2015)Migrating from planar to FinFET for further CMOS scaling: SOI or bulk?, , , , , , , , , and 9 other author(s). ESSCIRC, page 84-87. IEEE, (2009)Cu pumping in TSVs: Effect of pre-CMP thermal budget., , , , , , , , , and . Microelectron. Reliab., 51 (9-11): 1856-1859 (2011)Enhancement of CBRAM performance by controlled formation of a hourglass-shaped filament., , , , , , and . NVMTS, page 1-5. IEEE, (2017)Projeto de fabricação de HBTs.. University of Campinas, Brazil, (1999)ndltd.org (oai:repositorio.unicamp.br:REPOSIP/260828).