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Towards accurate temperature prediction in BEOL for reliability assessment (Invited)., , , , , , , , , and 1 other author(s). IRPS, page 1-7. IEEE, (2023)Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation., , , , , , , , , and 7 other author(s). IRPS, page 1-6. IEEE, (2024)III-V HBTs on 300 mm Si substrates using merged nano-ridges and its application in the study of impact of defects on DC and RF performance., , , , , , , , , and 4 other author(s). ESSDERC, page 261-264. IEEE, (2022)Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs)., , , , , , , , , and 6 other author(s). IRPS, page 1-7. IEEE, (2023)Impact of channel thickness scaling on the performance of GaN-on-Si RF HEMTs on highly C-doped GaN buffer., , , , , , , , , and 4 other author(s). ESSDERC, page 384-387. IEEE, (2022)Performance Trade-Off Scenarios for GAA Nanosheet FETs Considering Inner-spacers and Epi-induced Stress: Understanding & Mitigating Process Risks., , , , , , , and . ESSCIRC, page 55-58. IEEE, (2021)Self-Heating in iN8-iN2 CMOS Logic Cells: Thermal Impact of Architecture (FinFET, Nanosheet, Forksheet and CFET) and Scaling Boosters., , , , , , and . VLSI Technology and Circuits, page 371-372. IEEE, (2022)