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Towards accurate temperature prediction in BEOL for reliability assessment (Invited).

, , , , , , , , , , и . IRPS, стр. 1-7. IEEE, (2023)

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Zsolt Zrinyi

Zsolt Szücs

Zsolt Szabó

Zsolt Szabó

Zsolt Szentiványi

 

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A tool flow for predicting system level timing failures due to interconnect reliability degradation., , , , , и . ACM Great Lakes Symposium on VLSI, стр. 291-296. ACM, (2008)First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP., , , , , , , , , и 5 other автор(ы). VLSI Technology and Circuits, стр. 1-2. IEEE, (2022)Layout dependency induced deviation from Poisson area scaling in BEOL dielectric reliability., , , , и . Microelectron. Reliab., 45 (9-11): 1299-1304 (2005)Global Is the New Local: FPGA Architecture at 5nm and Beyond., , , и . FPGA, стр. 34-44. ACM, (2021)Electromigration limits of copper nano-interconnects., , , и . IRPS, стр. 1-6. IEEE, (2021)Metal reliability mechanisms in Ruthenium interconnects., , , , , , , , и . IRPS, стр. 1-7. IEEE, (2020)Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch., , , , и . IRPS, стр. 1-6. IEEE, (2019)Stress mitigation of 3D-stacking/packaging induced stresses., , , , , , , , и . IRPS, стр. 4. IEEE, (2018)Ultra-Scaled E-Tree-Based SRAM Design and Optimization With Interconnect Focus., , , , , , , , и . IEEE Trans. Circuits Syst. I Regul. Pap., 71 (10): 4597-4610 (октября 2024)Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps., , , , , , , , и . IRPS, стр. 1-6. IEEE, (2021)