Author of the publication

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Towards accurate temperature prediction in BEOL for reliability assessment (Invited)., , , , , , , , , and 1 other author(s). IRPS, page 1-7. IEEE, (2023)System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents., , , , and . IRPS, page 1-7. IEEE, (2022)Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism., , , , , , , and . IRPS, page 4. IEEE, (2022)Silicon Photonics for 56G NRZ Optical Interconnects., , , , , , , , , and 7 other author(s). OFC, page 1-3. IEEE, (2018)Degradation mechanisms and lifetime assessment of Ge Vertical PIN photodetectors., , , , , , , and . OFC, page 1-3. IEEE, (2022)Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation., , , , , and . Microelectron. Reliab., (2016)Variation-Aware Physics-Based Electromigration Modeling and Experimental Calibration for VLSI Interconnects., , , , , , , and . IRPS, page 1-6. IEEE, (2019)Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects., , , , , , , , , and 1 other author(s). Microelectron. Reliab., (2017)Time-Dependent Electromigration Modeling for Workload-Aware Design-Space Exploration in STT-MRAM., , , , , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 41 (12): 5327-5332 (2022)A pragmatic network-aware paradigm for system-level electromigration predictions at scale., , , and . IRPS, page 1-6. IEEE, (2023)