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Deep Learning-Based Subsurface Damage Localization Using Full-Field Surface Strains.

, , and . Sensors, 23 (17): 7445 (September 2023)

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Deep Learning-Based Subsurface Damage Localization Using Full-Field Surface Strains., , and . Sensors, 23 (17): 7445 (September 2023)Integration scheme for 3D NAND with nonreplacement word line and its cell characteristics investigation., , , , , , , , , and 5 other author(s). IMW, page 1-4. IEEE, (2021)Modeling of Negative Bias Temperature Instability (NBTI) for Gate-All-Around (GAA) Stacked Nanosheet Technology., , , , , , , , , and . IRPS, page 7. IEEE, (2024)Modeling and Optimization of Advanced 3D NAND Memory., , , , , , , and . DRC, page 1-2. IEEE, (2020)MAP: A Visual Analytics System for Job Monitoring and Analysis., and . CLUSTER, page 442-448. IEEE, (2020)An improved content based collaborative filtering algorithm for movie recommendations., , and . IC3, page 1-3. IEEE Computer Society, (2017)Highly-Doped Through-Contact Silicon Epi Design at 3 nm node., , , , , , , , , and 1 other author(s). DRC, page 55-56. IEEE, (2019)BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond., , , , , , , , , and 23 other author(s). VLSI Technology and Circuits, page 1-2. IEEE, (2023)An Integrated Job Monitor, Analyzer and Predictor., and . CLUSTER, page 609-617. IEEE, (2021)Contact Cavity Shaping and Selective SiGe: B Low-Temperature Epitaxy Process Solution for sub 10-9 Ω.cm2 Contact Resistivity in Nonplanar FETs., , , , , , , , , and 5 other author(s). VLSI Technology and Circuits, page 1-2. IEEE, (2023)