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Disambiguation of "Vermeersch, Bjorn"

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Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC.

, , , , , , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 31 (12): 1896-1904 (December 2023)

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Saskia Björn

Bolli Björnsson

Gerhild Bjornson

Ulf Björner

Anders Jørgen Bjørndalen

 

Other publications of authors with the same name

Influence of substrate thickness on thermal impedance of microelectronic structures., and . Microelectron. Reliab., 47 (2-3): 437-443 (2007)Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC., , , , , , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 31 (12): 1896-1904 (December 2023)Dynamic electrothermal simulation of integrated resistors at device level., and . Microelectron. J., 40 (9): 1411-1416 (2009)Dynamic thermal modelling of a power integrated circuit with the application of structure functions., , , , , and . Microelectron. J., 40 (7): 1135-1140 (2009)Thermal impedance plots of micro-scaled devices., and . Microelectron. Reliab., 46 (1): 174-177 (2006)Influence of thermal contact resistance on thermal impedance of microelectronic structures., and . Microelectron. Reliab., 47 (8): 1233-1238 (2007)Towards accurate temperature prediction in BEOL for reliability assessment (Invited)., , , , , , , , , and 1 other author(s). IRPS, page 1-7. IEEE, (2023)Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation., , , , , , , , , and 7 other author(s). IRPS, page 1-6. IEEE, (2024)Impact of channel thickness scaling on the performance of GaN-on-Si RF HEMTs on highly C-doped GaN buffer., , , , , , , , , and 4 other author(s). ESSDERC, page 384-387. IEEE, (2022)Self-Heating in iN8-iN2 CMOS Logic Cells: Thermal Impact of Architecture (FinFET, Nanosheet, Forksheet and CFET) and Scaling Boosters., , , , , , and . VLSI Technology and Circuits, page 371-372. IEEE, (2022)