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A content addressable memory with multi-Vdd scheme for low power tunable operation., , , , , , , , and . MWSCAS, page 401-404. IEEE, (2017)3DIC multi-project fabrication run being organized by CMC/CMP/MOSIS and Tezzaron.. 3DIC, page 1-10. IEEE, (2010)Investigation of Timing Properties for an Event Driven with Access and Reset Decoder Readout Architecture for a Pixel Array., , and . PRIME, page 113-116. IEEE, (2022)Pixellated readout IC: Analysis for single photon infrared detector for fast time of arrival applications., , , and . ISCAS, page 682-685. IEEE, (2015)Peak Prediction Using Multi Layer Perceptron (MLP) for Edge Computing ASICs Targeting Scientific Applications., , , , , , , , , and 1 other author(s). ISQED, page 1-6. IEEE, (2022)A 1.2-V 6-GHz Dual-Path Charge-Pump PLL Frequency Synthesizer for Quantum Control and Readout in CMOS 65-nm Process., , , and . UEMCON, page 570-576. IEEE, (2020)Pixel detectors in 3D technologies for high energy physics., , , , , , and . 3DIC, page 1-4. IEEE, (2010)Design and Challenges of Edge Computing ASICs on Front-End Electronics., , , , , , , , and . ISQED, page 19-27. IEEE, (2022)Ultra fast X-ray detection systems in nanometer and 3D technologies., , , , , , , , , and 2 other author(s). MIXDES, page 38-41. IEEE, (2014)Self-Adaptation of Line Driver Pre-Emphasis Parameters via Embedded Line Loss Sensing., , , , and . PRIME, page 249-252. IEEE, (2023)