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A content addressable memory with multi-Vdd scheme for low power tunable operation., , , , , , , , и . MWSCAS, стр. 401-404. IEEE, (2017)3DIC multi-project fabrication run being organized by CMC/CMP/MOSIS and Tezzaron.. 3DIC, стр. 1-10. IEEE, (2010)Pixellated readout IC: Analysis for single photon infrared detector for fast time of arrival applications., , , и . ISCAS, стр. 682-685. IEEE, (2015)Investigation of Timing Properties for an Event Driven with Access and Reset Decoder Readout Architecture for a Pixel Array., , и . PRIME, стр. 113-116. IEEE, (2022)Peak Prediction Using Multi Layer Perceptron (MLP) for Edge Computing ASICs Targeting Scientific Applications., , , , , , , , , и 1 other автор(ы). ISQED, стр. 1-6. IEEE, (2022)A 1.2-V 6-GHz Dual-Path Charge-Pump PLL Frequency Synthesizer for Quantum Control and Readout in CMOS 65-nm Process., , , и . UEMCON, стр. 570-576. IEEE, (2020)Pixel detectors in 3D technologies for high energy physics., , , , , , и . 3DIC, стр. 1-4. IEEE, (2010)Design and Challenges of Edge Computing ASICs on Front-End Electronics., , , , , , , , и . ISQED, стр. 19-27. IEEE, (2022)Ultra fast X-ray detection systems in nanometer and 3D technologies., , , , , , , , , и 2 other автор(ы). MIXDES, стр. 38-41. IEEE, (2014)Automated and Holistic Co-design of Neural Networks and ASICs for Enabling In-Pixel Intelligence., , , , , , и . CoRR, (2024)