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InGaAs FinFETs 3D Sequentially Integrated on FDSOI Si CMOS with Record Perfomance.

C. Convertino, C. Zota, D. Caimi, M. Sousa, and L. Czornomaz. ESSDERC, page 162-165. IEEE, (2018)

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Annalisa Caimi

Gabrio Caimi

Mario Caimi

Daniele Soroldoni

Daniele Silvestro

Other publications of authors with the same name

Heterogeneous Co-Integration of BTO/Si and III-V Technology on a Silicon Photonics Platform.P. Stark, F. Eltes, Y. Baumgartner, D. Caimi, Y. Popoff, N. Meier, L. Czornomaz, J. Fompeyrine, B. Offrein, and S. Abel. OFC, page 1-3. IEEE, (2020)A Non-Volatile Optical Memory in Silicon Photonics.J. Geler-Kremer, F. Eltes, P. Stark, A. Sharma, D. Caimi, B. Offrein, J. Fompeyrine, and S. Abel. OFC, page 1-3. IEEE, (2021)CMOS-Compatible Hybrid III-V/Si Photodiodes Using a Lateral Current Collection Scheme.Y. Baumgartner, C. Caer, M. Seifried, G. Villares, D. Caimi, T. Morf, J. Faist, B. Offrein, and L. Czornomaz. ECOC, page 1-3. IEEE, (2018)Microstructure and ferroelectricity of barium titanate thin films on Si for integrated photonics.K. Kormondy, A. Demkov, Y. Popoff, M. Sousa, F. Eltes, D. Caimi, C. Marchiori, J. Fompeyrine, and S. Abel. ICICDT, page 1-2. IEEE, (2017)Hybrid InGaAs/SiGe CMOS circuits with 2D and 3D monolithic integration.V. Deshpande, H. Hahn, V. Djara, E. O'Connor, D. Caimi, M. Sousa, J. Fompeyrine, and L. Czornomaz. ESSDERC, page 244-247. IEEE, (2017)Novel CMOS-Compatible Ultralow Capacitance Hybrid III-V/Si Photodetectors Tested up to 32 Gbps NRZ.Y. Baumgartner, M. Seifried, C. Caer, P. Stark, D. Caimi, J. Faist, B. Offrein, and L. Czornomaz. OFC, page 1-3. IEEE, (2019)Record High Pockels Coefficient in PIC-Compatible BaTiO3/Si Photonic Devices.F. Eltes, J. Ortmann, D. Urbonas, D. Caimi, L. Czornomaz, C. Mai, L. Zimmermann, J. Fompeyrine, and S. Abel. ECOC, page 1-3. IEEE, (2018)CMOS-embedded lasers for advanced silicon photonic devices.M. Seifried, H. Hahn, G. Villares, F. Horst, D. Caimi, C. Caer, Y. Baumgartner, M. Sousa, R. Dangel, L. Czornomaz and 1 other author(s). ICTON, page 1-4. IEEE, (2017)Scalability of ultra-thin-body and BOX InGaAs MOSFETs on silicon.L. Czornomaz, N. Daix, P. Kerber, K. Lister, D. Caimi, C. Rossel, M. Sousa, E. Uccelli, and J. Fompeyrine. ESSDERC, page 143-146. IEEE, (2013)Barium-titanate integrated with silicon photonics for ultra-efficient electro-optical performance.S. Abel, T. Stoferle, C. Marchiori, D. Caimi, L. Czornomaz, M. Rossell, R. Erni, M. Sousa, H. Siegwart, B. Offrein and 1 other author(s). ECOC, page 1-3. IEEE, (2015)

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Disambiguation of "Caimi, Daniele"

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InGaAs FinFETs 3D Sequentially Integrated on FDSOI Si CMOS with Record Perfomance.

Please choose a person to relate this publication to

Annalisa Caimi

Gabrio Caimi

Mario Caimi

Daniele Soroldoni

Daniele Silvestro

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Caimi, Daniele"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML InGaAs FinFETs 3D Sequentially Integrated on FDSOI Si CMOS with Record Perfomance.

Please choose a person to relate this publication to

Annalisa Caimi

Gabrio Caimi

Mario Caimi

Daniele Soroldoni

Daniele Silvestro

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
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APA
Chicago
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InGaAs FinFETs 3D Sequentially Integrated on FDSOI Si CMOS with Record Perfomance.