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A 16 GB 1024 GB/s HBM3 DRAM With Source-Synchronized Bus Design and On-Die Error Control Scheme for Enhanced RAS Features., , , , , , , , , и 29 other автор(ы). IEEE J. Solid State Circuits, 58 (4): 1051-1061 (2023)A 16 GB 1024 GB/s HBM3 DRAM with On-Die Error Control Scheme for Enhanced RAS Features., , , , , , , , , и 28 other автор(ы). VLSI Technology and Circuits, стр. 130-131. IEEE, (2022)Student Session: Comparative Analysis of Live VM Migration with SGX Enclave., , , и . RTCSA, стр. 1-2. IEEE, (2020)Hints for Memory Optimization of Asylo-based SGX Enclave Applications., , , , и . ICTC, стр. 1685-1690. IEEE, (2020)A Three-Dimensional Arrayed Microfluidic Blood-Brain Barrier Model With Integrated Electrical Sensor Array., , , , , , и . IEEE Trans. Biomed. Eng., 65 (2): 431-439 (2018)Evaluation of Large-Sized LCD Touch Panel Using Differential Sensing Circuit and Algorithm., , , , , и . IEICE Trans. Inf. Syst., 97-D (5): 1363-1366 (2014)22.1 A 1.1V 16GB 640GB/s HBM2E DRAM with a Data-Bus Window-Extension Technique and a Synergetic On-Die ECC Scheme., , , , , , , , , и 25 other автор(ы). ISSCC, стр. 330-332. IEEE, (2020)