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Chip-to-chip communication based on capacitive coupling., , , , , , and . 3DIC, page 1-6. IEEE, (2009)3D system on chip memory interface based on modeled capacitive coupling interconnections., , , , , , , and . 3DIC, page 1-4. IEEE, (2010)From Heterogeneous Sensor Networks to Integrated Software Services: Design and Implementation of a Semantic Architecture for the Internet of Things at ARCES@UNIBO., , , , , , , , , and 6 other author(s). FRUCT, page 10-18. IEEE, (2018)RFI/Q Downconverter With Gain/Phase Calibration., , and . IEEE Trans. Circuits Syst. II Express Briefs, 54-II (4): 367-371 (2007)Input/Output Pad for Direct Contact and Contactless Testing., , , , , , , , , and . ETS, page 135-140. IEEE Computer Society, (2011)A photodiode cell for applications to position and motion estimation sensors., , , and . IEEE Trans. Ind. Electron., 43 (1): 200-206 (1996)A design flow for inductively degenerated LNAs., , and . ICECS, page 615-618. IEEE, (2004)Active electrode IC combining EEG, electrical impedance tomography, continuous contact impedance measurement and power supply on a single wire., , , and . ESSCIRC, page 335-338. IEEE, (2011)Quadrature VCO based on direct second harmonic locking., , , and . ISCAS (1), page 169-172. IEEE, (2004)3D capacitive transmission of analog signals with automatic compensation of the voltage attenuation., , , , , , , and . ESSCIRC, page 116-119. IEEE, (2009)