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Disambiguation of "Rhee, Hwasung"

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Machine Learning Based V-ramp VBD Predictive Model Using OCD-measured Fab Parameters for Early Detection of MOL Reliability Risk.

, , , , , , , , and . IRPS, page 1-4. IEEE, (2023)

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Sascha Rhee

Hanjo Rhee

Sora Rhee

Kyu Ho Rhee

Jong Il Rhee

 

Other publications of authors with the same name

Systematic Study of Process Impact on FinFET Reliability., , , , , , , , , and 5 other author(s). IRPS, page 1-5. IEEE, (2021)Advanced Self-heating Model and Methodology for Layout Proximity Effect in FinFET Technology., , , , , , , , , and 3 other author(s). IRPS, page 1-5. IEEE, (2020)Reliability of Industrial grade Embedded-STT-MRAM., , , , , , , , , and 21 other author(s). IRPS, page 1-3. IEEE, (2020)Reliability on EUV Interconnect Technology for 7nm and beyond., , , , , , , , , and 7 other author(s). IRPS, page 1-4. IEEE, (2020)Trap Density Modulation for IO FinFET NBTI Improvement., , , , , , , , , and 5 other author(s). IRPS, page 1-5. IEEE, (2020)Time Dependent Variability in Advanced FinFET Technology for End-of-Lifetime Reliability Prediction., , , , , , , and . IRPS, page 1-6. IEEE, (2021)Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique., , , , , , and . IRPS, page 1-6. IEEE, (2021)Soft-Error Susceptibility in Flip-Flop in EUV 7 nm Bulk-FinFET Technology., , , , , , , , , and 1 other author(s). IRPS, page 1-7. IEEE, (2021)Investigating of SER in 28 nm FDSOI-Planar and Comparing with SER in Bulk-FinFET., , , , , , , , , and 6 other author(s). IRPS, page 1-5. IEEE, (2020)Backside Alpha-Irradiation Test in Flip-Chip Package in EUV 7 nm FinFET SRAM., , , , , , , , , and 4 other author(s). IRPS, page 1-4. IEEE, (2020)