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Efficient region-aware P/G TSV planning for 3D ICs., , , , , и . ISQED, стр. 171-178. IEEE, (2014)Improved heuristic equivalent search algorithm based on Maximal Information Coefficient for Bayesian Network Structure Learning., , и . Neurocomputing, (2013)Robust Kernelized Multi-View Self-Representations for Clustering by Tensor Multi-Rank Minimization., , , и . CoRR, (2017)Die Stacking Is Happening, , и . IEEE Micro, 38 (1): 22--28 (2018)A customized design of DRAM controller for on-chip 3D DRAM stacking., , , , , , , и . CICC, стр. 1-4. IEEE, (2010)Security Threats and Countermeasures in Three-Dimensional Integrated Circuits., , , , , и . ACM Great Lakes Symposium on VLSI, стр. 321-326. ACM, (2017)Cost-effective design of scalable high-performance systems using active and passive interposers., , , и . ICCAD, стр. 728-735. IEEE, (2017)GraphIA: an in-situ accelerator for large-scale graph processing., , , , и . MEMSYS, стр. 79-84. ACM, (2018)Cost-aware three-dimensional (3D) many-core multiprocessor design., , и . DAC, стр. 126-131. ACM, (2010)Core vs. uncore: the heart of darkness., , , , , и . DAC, стр. 121:1-121:6. ACM, (2015)