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DE-HNN: An effective neural model for Circuit Netlist representation.

, , , , , , , , and . AISTATS, volume 238 of Proceedings of Machine Learning Research, page 4258-4266. PMLR, (2024)

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3D-enabled customizable embedded computer (3DECC)., , , , , , , , , and 2 other author(s). 3DIC, page 1-3. IEEE, (2014)Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks., , , , , , and . 3DIC, page TS10.2.1-TS10.2.4. IEEE, (2015)Creating 3D specific systems: Architecture, design and CAD., , and . DATE, page 1684-1688. IEEE Computer Society, (2010)Design and CAD for 3D integrated circuits., , , , , , , , , and 2 other author(s). DAC, page 668-673. ACM, (2008)Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits., , , and . 3DIC, page 1-3. IEEE, (2014)An energy-efficient 64-QAM MIMO detector for emerging wireless standards., , , , and . DATE, page 246-251. IEEE, (2011)Exploring compromises among timing, power and temperature in three-dimensional integrated circuits., , , , , , and . DAC, page 997-1002. ACM, (2006)Coordinating 3D designs: Interface IP, standards or free form?, , , , , , and . 3DIC, page 1-3. IEEE, (2011)Fast and Accurate PPA Modeling with Transfer Learning., , and . MLCAD, page 1-6. IEEE, (2021)Computing in 3D., , , , , , , , , and 1 other author(s). CICC, page 1-6. IEEE, (2015)