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A 3V 110µW 3.1 ppm/°C curvature-compensated CMOS bandgap reference., , , , , , and . ISCAS, IEEE, (2006)Bonding-pad-oriented on-chip ESD protection structures for ICs., , , , , , and . ISCAS (1), page 741-744. IEEE, (2003)Designing a C-STEAM Course for Enhancing Children's Positive Psychological Characters and Learning Performance: A Two-Stage Experiment: This study examines the effects of positive psychology education in cultural learning., and . ICETC, page 302-308. ACM, (2021)A 5 GHz sub-harmonic direct down-conversion mixer for dual-band system in 0.35µm SiGe BiCMOS., , , , , and . ISCAS (5), page 4807-4810. IEEE, (2005)A 3V 110µW 3.1 ppm/°C curvature-compensated CMOS bandgap reference., , , , , and . ISCAS, IEEE, (2006)Concept and extraction method of ESD-critical parameters for function-based layout-level ESD protection circuit design verification., , , , , , and . ASP-DAC, page 710-712. IEEE Computer Society, (2004)Mixed-mode ESD protection circuit simulation-design methodology., , , , , , and . ISCAS (4), page 652-655. IEEE, (2003)A technology-independent CAD tool for ESD protection device extraction: ESDExtractor., , , , , and . ICCAD, page 510-513. ACM / IEEE Computer Society, (2002)