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A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit.

A. Samanta, P. Chang, P. Yan, M. Fu, M. On, A. Kumar, H. Kang, I. Yi, D. Annabattuni, Y. Zhang, D. Scott, R. Patti, Y. Fan, Y. Zhu, S. Palermo, and S. Yoo. OFC, page 1-3. IEEE, (2023)

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Ewha Kang

Mihyun Kang

Kang Teng

Mujin Kang

Namhi Kang

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A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit.A. Samanta, P. Chang, P. Yan, M. Fu, M. On, A. Kumar, H. Kang, I. Yi, D. Annabattuni, Y. Zhang and 6 other author(s). OFC, page 1-3. IEEE, (2023)A Sub-500fJ/bit 3D Direct Bond Silicon Photonic Transceiver in 12nm FinFET.P. Chang, A. Samanta, P. Yan, M. Fu, Y. Zhang, M. On, A. Kumar, H. Kang, I. Yi, D. Annabattuni and 6 other author(s). VLSI Technology and Circuits, page 1-2. IEEE, (2023)A 12.5 Gb/s 1.38 mW Inverter-Based Optical Receiver in 28 nm CMOS.P. Yan, C. Hong, P. Chang, H. Kang, D. Annabattuni, A. Kumar, Y. Fan, R. Liu, R. Rady, and S. Palermo. MWSCAS, page 1-4. IEEE, (2022)

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Disambiguation of "Kang, Hyungryul"

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A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit.

Please choose a person to relate this publication to

Ewha Kang

Mihyun Kang

Kang Teng

Mujin Kang

Namhi Kang

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Kang, Hyungryul"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit.

Please choose a person to relate this publication to

Ewha Kang

Mihyun Kang

Kang Teng

Mujin Kang

Namhi Kang

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
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APA
Chicago
DIN 1505
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A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit.