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Special Session: Machine Learning for Semiconductor Test and Reliability., , , , , , , , , and . VTS, page 1-11. IEEE, (2021)Fast Thermal Analysis for Chiplet Design based on Graph Convolution Networks., , and . ASP-DAC, page 485-492. IEEE, (2022)GridNet: Fast Data-Driven EM-Induced IR Drop Prediction and Localized Fixing for On-Chip Power Grid Networks., , and . ICCAD, page 160:1-160:9. IEEE, (2020)Data-Driven Fast Electrostatics and TDDB Aging Analysis., , , and . MLCAD, page 71-76. ACM, (2020)Fast Electrostatic Analysis For VLSI Aging based on Generative Learning., , , and . MLCAD, page 1-6. IEEE, (2021)EM-GAN: Data-Driven Fast Stress Analysis for Multi-Segment Interconnects., , , , and . ICCD, page 296-303. IEEE, (2020)Data-Driven Electrostatics Analysis based on Physics-Constrained Deep learning., , and . DATE, page 1382-1387. IEEE, (2021)HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-Informed Neural Network., , , , and . ICCAD, page 28:1-28:9. ACM, (2022)EM-GAN: Fast Stress Analysis for Multi-Segment Interconnect Using Generative Adversarial Networks., , , and . CoRR, (2020)PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks., , , , and . ICCAD, page 1-9. IEEE, (2023)