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Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.

, , , , , , , , and . Microelectron. J., 35 (9): 693-700 (2004)

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Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization., , , , , , , , and . Microelectron. J., 35 (9): 693-700 (2004)A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections., , , , , , , and . Microelectron. Reliab., 45 (3-4): 517-525 (2005)Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration., , , and . Microelectron. J., 34 (2): 109-113 (2003)Tree identification using a distributed K-mean clustering algorithm., , , , and . IGARSS, page 3446-3449. IEEE, (2010)Factors controlling ionospheric outflows as observed at intermediate altitudes, , , , and . Journal of Geophysical Research: Space Physics, (2005)A03221.Insulation of Carbon Nanotube Yarn Electrodes for Intrafascicular Neural Stimulation and Recording., , , , , , , , and . NER, page 815-818. IEEE, (2019)A Parallel Differential Box Counting Algorithm Applied to Hyperspectral Image Classifications., , , and . IGARSS (5), page 216-219. IEEE, (2009)Temperature-Insensitive Soft-Error-Tolerant Flip-Flop Design For Automotive Electronics., , , , and . VTS, page 1-7. IEEE, (2024)