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Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.

C. Tsang, C. Li, A. Krishnamoorthy, Y. Su, H. Li, L. Wong, W. Li, L. Tang, and K. Ee. Microelectron. J., 35 (9): 693-700 (2004)

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H -W Müller

W H Oertel

W H Müller

Peter H W Prenninger

Joachim W H Haes

Other publications of authors with the same name

Intelligent methodology for sensing, modeling, and control of weld penetration in robotic welding system.T. Lin, H. Chen, W. Li, and S. Chen. Ind. Robot, 36 (6): 585-593 (2009)What is the bootstrap technique?W. Li, and A. Zharkikh. Systematic Biology, (1994)A neural network solver for basis pursuit and its applications to time-frequency analysis of biomedical signals.Z. Wang, Y. Xia, W. Li, Z. He, and J. Chen. ICNN, page 2057-2060. IEEE, (1997)Is the guinea-pig a rodent?D. Graur, W. Hide, and W. Li. Nature, (1991)NJML: a Hybrid Algorithm for the Neighbor-Joining and Maximum-Likelihood MethodsS. Ota, and W. Li. Molecular Biology and Evolution, (2000)Inconsistency of the Maximum Parsimony Method: The Case of Five Taxa With a Molecular ClockA. Zharkikh, and W. Li. Systematic Biology, (1993)Mechanical properties of piezoelectric PVDF/MWCNT fibers prepared by flat/hollow cylindrical near-field electrospinning process.Z. Liu, C. Pan, L. Lin, H. Li, C. Ke, J. Huang, and P. Wang. NEMS, page 707-710. IEEE, (2013)Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.C. Tsang, C. Li, A. Krishnamoorthy, Y. Su, H. Li, L. Wong, W. Li, L. Tang, and K. Ee. Microelectron. J., 35 (9): 693-700 (2004)A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections.C. Tsang, C. Chang, A. Krishnamoorthy, K. Ee, Y. Su, H. Li, W. Li, and L. Wong. Microelectron. Reliab., 45 (3-4): 517-525 (2005)N × N Coupler Uniformity in a CWDM Passive Star Home Network Based on Multimode Fiber: A Time-Effective Calculation Method.F. Richard, P. Guignard, A. Pizzinat, E. Tanguy, and H. Li. JOCN, 4 (9): A48-A58 (2012)

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Disambiguation of "Li, W. H."

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Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.

Please choose a person to relate this publication to

H -W Müller

W H Oertel

W H Müller

Peter H W Prenninger

Joachim W H Haes

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Li, W. H."

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.

Please choose a person to relate this publication to

H -W Müller

W H Oertel

W H Müller

Peter H W Prenninger

Joachim W H Haes

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.