Author of the publication

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Multi-Project System-on-Chip (MP-SoC): A Novel Test Vehicle for SoC Silicon Prototyping.

C. Huang, K. Lee, C. Yang, W. Hu, S. Wang, J. Chen, C. Chen, L. Van, C. Wu, W. Tsai, and J. Jou. SoCC, page 137-140. IEEE, (2006)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Chih-Yun Yang

Chia-Chih Yang

Matei Chihaia

Walid Shehab Chihab

Cristian IonutÌ§ Chihaia

Other publications of authors with the same name

A modularized 3D heterogeneous system integration platform.C. Huang, C. Yang, C. Wu, C. Lin, C. Chiu, Y. Liu, C. Chu, N. Chang, and W. Chen. APCCAS, page 396-399. IEEE, (2012)PrSoC: Programmable System-on-chip (SoC) for silicon prototyping.C. Huang, C. Wu, C. Yang, and C. Wey. ISCAS, page 3382-3385. IEEE, (2008)Implementation and Prototyping of a Complex Multi-project System-on-a-chip.C. Huang, C. Wu, C. Yang, W. Chien, S. Chen, C. Chen, J. Wang, and C. Wey. ISCAS, page 2321-2324. IEEE, (2009)An efficient memory controller for 3D heterogeneous integration platform.Y. Liu, C. Yang, S. Chen, C. Chiu, C. Wu, and C. Huang. VLSI-DAT, page 1-4. IEEE, (2012)A framework for the design of error-aware power-efficient fixed-width Booth multipliers.M. Song, L. Van, C. Yang, S. Chiu, and S. Kuo. ISCAS (1), page 81-84. IEEE, (2005)Live Demonstration: A Plug-and-Sense Smart Sensor System.C. Yang, Y. Hsieh, C. Cheng, W. Lai, C. Wu, and C. Huang. IEEE SENSORS, page 1. IEEE, (2019)Live Demonstration: SenCu - A Power-Efficient Sensor System.S. Chen, C. Yang, F. Cheng, Y. Kuo, J. Chue, C. Chen, C. Wu, and C. Huang. IEEE SENSORS, page 1. IEEE, (2020)AI-EMS: An Environmental Monitoring System with AI Prediction.C. Yang, C. Kuo, S. Chen, H. Liu, F. Cheng, Y. Hsieh, J. Chue, C. Wu, and C. Huang. SENSORS, page 1-4. IEEE, (2023)A novel design flow for a 3D heterogeneous system prototyping platform.C. Huang, C. Yang, C. Wu, C. Chiu, Y. Liu, C. Chu, N. Chang, W. Chen, C. Lin, and H. Luo. SoCC, page 78-82. IEEE, (2012)Boundary scan test solution for MorPACK platform.C. Huang, C. Yang, C. Wu, C. Lin, C. Chiu, Y. Liu, C. Chiu, C. Lin, and W. Chien. ISPACS, page 802-805. IEEE, (2012)

BibSonomy

Disambiguation of "Yang, Chih-Chyau"

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Multi-Project System-on-Chip (MP-SoC): A Novel Test Vehicle for SoC Silicon Prototyping.

Please choose a person to relate this publication to

Chih-Yun Yang

Chia-Chih Yang

Matei Chihaia

Walid Shehab Chihab

Cristian IonutÌ§ Chihaia

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Yang, Chih-Chyau"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Multi-Project System-on-Chip (MP-SoC): A Novel Test Vehicle for SoC Silicon Prototyping.

Please choose a person to relate this publication to

Chih-Yun Yang

Chia-Chih Yang

Matei Chihaia

Walid Shehab Chihab

Cristian IonutÌ§ Chihaia

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Multi-Project System-on-Chip (MP-SoC): A Novel Test Vehicle for SoC Silicon Prototyping.