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Characterization of time-dependent variability using 32k transistor arrays in an advanced HK/MG technology., , , , , , , , , and . IRPS, page 3. IEEE, (2015)Accelerated Capture and Emission (ACE) Measurement Pattern for Efficient BTI Characterization and Modeling., , , , , , , , , and . IRPS, page 1-7. IEEE, (2019)Impact of time-dependent variability on the yield and performance of 6T SRAM cells in an advanced HK/MG technology., , , , and . ICICDT, page 1-4. IEEE, (2015)New methodology for modelling MOL TDDB coping with variability., , , , , and . IRPS, page 3. IEEE, (2018)Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 stacks for sequential 3D integrations., , , , , and . IRPS, page 1-7. IEEE, (2023)Assessment of critical Co electromigration parameters., , , , , , , , and . IRPS, page 8. IEEE, (2022)Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill., , , , , , , , , and . IRPS, page 1-6. IEEE, (2020)Time dependent variability in RMG-HKMG FinFETs: Impact of extraction scheme on stochastic NBTI., , , , , and . IRPS, page 3. IEEE, (2015)NBTI in Si0.55Ge0.45 cladding p-FinFETs: Porting the superior reliability from planar to 3D architectures., , , , , , , , , and . IRPS, page 2. IEEE, (2015)Extended RVS characterisation of STT-MRAM devices: Enabling detection of AP/P switching and breakdown., , , , , , , , , and 1 other author(s). IRPS, page 5-1. IEEE, (2018)