%0 Journal Article %1 journals/mj/TsangLKSLWLTE04 %A Tsang, C. F. %A Li, C. Y. %A Krishnamoorthy, A. %A Su, Y. J. %A Li, H. Y. %A Wong, L. Y. %A Li, W. H. %A Tang, L. J. %A Ee, K. Y. %D 2004 %J Microelectron. J. %K dblp %N 9 %P 693-700 %T Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization. %U http://dblp.uni-trier.de/db/journals/mj/mj35.html#TsangLKSLWLTE04 %V 35

@article{journals/mj/TsangLKSLWLTE04, added-at = {2020-02-22T00:00:00.000+0100}, author = {Tsang, C. F. and Li, C. Y. and Krishnamoorthy, A. and Su, Y. J. and Li, H. Y. and Wong, L. Y. and Li, W. H. and Tang, L. J. and Ee, K. Y.}, biburl = {https://www.bibsonomy.org/bibtex/2c2f326f9f310fdd17a6e955b6fc690bb/dblp}, ee = {https://doi.org/10.1016/j.mejo.2004.06.019}, interhash = {ebd970623d2949c982d9574f2098a190}, intrahash = {c2f326f9f310fdd17a6e955b6fc690bb}, journal = {Microelectron. J.}, keywords = {dblp}, number = 9, pages = {693-700}, timestamp = {2020-02-25T13:01:00.000+0100}, title = {Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.}, url = {http://dblp.uni-trier.de/db/journals/mj/mj35.html#TsangLKSLWLTE04}, volume = 35, year = 2004 }