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Disambiguation of "Weide-Zaage, Kirsten"

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Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology.

, , , , , , and . ARC, volume 14251 of Lecture Notes in Computer Science, page 357-360. Springer, (2023)

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Kirsten Weide-Zaage

Maria Zaage

Martina Zaage

Joachim Zaage

Eva Zaage

 

Other publications of authors with the same name

Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology, , , , , , and . Applied Reconfigurable Computing. Architectures, Tools, and Applications, page 357--360. Cham, Springer Nature Switzerland, (2023)A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure, , , , , and . 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), page 1-5. (April 2023)Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads., , , and . Microelectron. Reliab., 53 (9-11): 1575-1580 (2013)SRAM Test Chip for Radiation Experiment, , , , , and . Pan Pacific Symposium 2022, (2022)Investigation of FPGA and SRAM Cells Under Radiation Exposure, , , and . 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), page 1-5. (April 2022)Qualification procedure for moisture in embedded capacitors., , , , , and . Microelectron. Reliab., 54 (9-10): 2013-2016 (2014)Influence of air gaps on the thermal-electrical-mechanical behavior of a copper metallization., , and . Microelectron. Reliab., 51 (9-11): 1587-1591 (2011)COTS--Harsh Condition Effects Considerations from Technology to User Level, and . (2017)Simulations in Terms of Radiation Effects on different BEOL Material Systems, , and . 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), page 1-4. (2019)Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps., , , and . Microelectron. Reliab., 55 (1): 192-200 (2015)