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A Gas Medium Approach To Sensitivity Improvement Of MEMS-Based Thermal Acoustic Particle Velocity Sensors., , , , , и . ICICDT, стр. 1-4. IEEE, (2019)Silicon-silicon anodic bonding process with embedded glass., , , , , и . NEMS, стр. 470-475. IEEE, (2015)Anemometer for detection of very low speed air flow with three-dimensional directionality., , , , и . NEMS, стр. 615-618. IEEE, (2017)Linearity analysis of closed-loop capacitive accelerometer due to distance mismatch between plates and the influence of compensation capacitor array., , , , , , , , , и . Sci. China Inf. Sci., 57 (6): 1-12 (2014)Design and simulation of corrugated diaphragm applied to the MEMS fiber optic pressure sensor., , , , и . NEMS, стр. 152-155. IEEE, (2016)High temperature pressure sensor using a thermostable electrode., , , , , , и . NEMS, стр. 201-204. IEEE, (2015)Design and fabrication of a mems capacitive accelerometer based on double-device-layers SOI wafer., , , , , и . NEMS, стр. 1036-1039. IEEE, (2010)Design of a graphene capacitive pressure sensor for ultra-low pressure detection., , , , и . NEMS, стр. 192-195. IEEE, (2016)Design of an ultra-low pressure sensor based on the growth of graphene on silicon dioxide surface., , и . NEMS, стр. 526-529. IEEE, (2017)A SOI sandwich differential capacitance accelerometer with low-stress package., , , и . NEMS, стр. 341-345. IEEE, (2014)