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Disambiguation of "Lim, Sung Kyu"

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Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs.

, , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 42 (7): 2331-2335 (July 2023)

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Sung-Ki Lim

Yong-Sung Lim

Han-Sung Lim

Sung-Kyu Hong

Sung-Yeun Lim

 

Other publications of authors with the same name

Multi-layer floorplanning for reliable system-on-package., , , and . ISCAS (5), page 69-72. IEEE, (2004)Fast and Accurate Full-chip Extraction and Optimization of TSV-to-Wire Coupling., , and . DAC, page 28:1-28:6. ACM, (2014)Profile-Driven Instruction Mapping for Dataflow Architectures., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 25 (12): 3017-3025 (2006)Design-Aware Partitioning-Based 3-D IC Design Flow With 2-D Commercial Tools., , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 41 (3): 410-423 (2022)Fast bidirectional shortest path on GPU., , , , , and . IEICE Electron. Express, 13 (6): 20160036 (2016)Ultra-Dense 3D Physical Design Unlocks New Architectural Design Points with Large Benefits., , , , , , , , , and . DATE, page 1-6. IEEE, (2023)DREAM-GAN: Advancing DREAMPlace towards Commercial-Quality using Generative Adversarial Learning., , , and . ISPD, page 141-148. ACM, (2023)On Legalization of Die Bonding Bumps and Pads for 3D ICs., , , , and . ISPD, page 62-70. ACM, (2023)Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICs., , , , and . ISPD, page 39-46. ACM, (2021)Driving Early Physical Synthesis Exploration through End-of-Flow Total Power Prediction., , , and . MLCAD, page 97-102. ACM / IEEE, (2022)