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A stochastic perturbative approach to design a defect-aware thresholder in the sense amplifier of crossbar memories., , , and . ASP-DAC, page 835-840. IEEE, (2009)Copper TSV-based die-level via-last 3D integration process with parylene-C adhesive bonding technique., , and . 3DIC, page 1-5. IEEE, (2016)Programmable active pixel sensor for low-light biomedical applications., , , and . BioCAS, page 655-658. IEEE, (2014)Full swing 20 GHz frequency divider with 1 V supply voltage in FD-SOI 28 nm technology., , , and . NORCAS, page 1-4. IEEE, (2015)Design Considerations and Performance Trade-Offs for 56Gb/s Discrete Multi-Tone Electrical Link., , , , and . MWSCAS, page 1147-1150. IEEE, (2019)Self-Calibrated Delay-Based LSB Extraction for Resolution Improvement in SAR ADCs., , and . NORCAS, page 1-7. IEEE, (2019)A Predictable Communication Scheme for Embedded Multiprocessor Systems., , , and . VLSI-SoC, page 152-157. IEEE, (2006)Non-filamentary non-volatile memory elements as synapses in neuromorphic systems., , , , , , , , , and . NVMTS, page 1-6. IEEE, (2019)Power-gated MOS current mode logic (PG-MCML): a power aware DPA-resistant standard cell library., , , , , and . DAC, page 1014-1019. ACM, (2011)Physical synthesis onto a Sea-of-Tiles with double-gate silicon nanowire transistors., , , and . DAC, page 42-47. ACM, (2012)