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Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate., , , , , , , , , and 2 other author(s). OFC, page 1-3. IEEE, (2021)5 mW/Gbps hybrid-integrated Si-photonics-based optical I/O cores and their 25-Gbps/ch error-free operation with over 300-m MMF., , , , , , , , , and 10 other author(s). OFC, page 1-3. IEEE, (2015)Automated tuning of an electronic circuit board using the artificial neural network approach., , , , and . J. Intell. Manuf., 7 (4): 329-339 (1996)A Modulation Package Tuning Machine Applying Fuzzy Logic., and . IEA/AIE, volume 604 of Lecture Notes in Computer Science, page 351-360. Springer, (1992)Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror., , , , , , , , and . 3DIC, page 1-4. IEEE, (2019)Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers., , , , , , , , and . 3DIC, page 1-6. IEEE, (2019)Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors., , , , , , , , , and . ECOC, page 1-4. IEEE, (2020)