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Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror.

, , , , , , , , и . 3DIC, стр. 1-4. IEEE, (2019)

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Akio Tsukimoto

Akio Sakaki

Akio Ito

Akio Ogawa

Paul Akio Sawada

 

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Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate., , , , , , , , , и 2 other автор(ы). OFC, стр. 1-3. IEEE, (2021)5 mW/Gbps hybrid-integrated Si-photonics-based optical I/O cores and their 25-Gbps/ch error-free operation with over 300-m MMF., , , , , , , , , и 10 other автор(ы). OFC, стр. 1-3. IEEE, (2015)Automated tuning of an electronic circuit board using the artificial neural network approach., , , , и . J. Intell. Manuf., 7 (4): 329-339 (1996)A Modulation Package Tuning Machine Applying Fuzzy Logic., и . IEA/AIE, том 604 из Lecture Notes in Computer Science, стр. 351-360. Springer, (1992)Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror., , , , , , , , и . 3DIC, стр. 1-4. IEEE, (2019)Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers., , , , , , , , и . 3DIC, стр. 1-6. IEEE, (2019)Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors., , , , , , , , , и . ECOC, стр. 1-4. IEEE, (2020)