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12.4 A 19μW 200Mb/s loT Tag Demonstrating High-Definition Video Streaming via a Digital-Switch-Based Reconfigurable 16-QAM Backscatter Communication Technique.

Y. Zhang, R. Luo, J. Xiong, S. Liang, и M. Meng. ISSCC, стр. 224-226. IEEE, (2024)

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Meng Meng

Xiaodan Miao

Jianmin Miao

Meng Meng Liang

Miao Zhang

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Cross-layer optimization schemes based on HARQ for Device-to-Device communication.M. meng Miao, J. Sun, и S. Shao. ComComAP, стр. 72-77. IEEE, (2014)12.4 A 19μW 200Mb/s loT Tag Demonstrating High-Definition Video Streaming via a Digital-Switch-Based Reconfigurable 16-QAM Backscatter Communication Technique.Y. Zhang, R. Luo, J. Xiong, S. Liang, и M. Meng. ISSCC, стр. 224-226. IEEE, (2024)Optimal resonance configuration for ultrasonic wireless power transmission to millimeter-sized biomedical implants.M. Meng, и M. Kiani. EMBC, стр. 1934-1937. IEEE, (2016)An Ultrasonically Powered Wireless System for In Vivo Gastric Slow-Wave Recording.M. Meng, P. Graybill, R. Ramos, A. Javan-Khoshkholgh, A. Farajidavar, и M. Kiani. EMBC, стр. 7064-7067. IEEE, (2019)Design considerations for ultrasonic power transmission to millimeter-sized implantable microelectronics devices.M. Meng, A. Ibrahim, и M. Kiani. BioCAS, стр. 1-4. IEEE, (2015)Multi-Beam Shared-Inductor Reconfigurable Voltage/SECE-Mode Piezoelectric Energy Harvesting of Multi-Axial Human Motion.M. Meng, A. Ibrahim, T. Xue, H. Yeo, D. Wang, S. Roundy, S. Trolier-McKinstry, и M. Kiani. ISSCC, стр. 426-428. IEEE, (2019)Inductive and ultrasonic wireless power transmission to biomedical implants.A. Ibrahim, M. Meng, и M. Kiani. ISCAS, стр. 1-4. IEEE, (2017)A Fully-Reflective Wi-Fi-Compatible Backscatter Communication System With Retro-Reflective MIMO Gain for Improved Range.M. Meng, M. Dunna, S. Kuo, H. Yu, P. Wang, D. Bharadia, и P. Mercier. IEEE J. Solid State Circuits, 58 (9): 2501-2512 (сентября 2023)12.2 Improving the Range of WiFi Backscatter Via a Passive Retro-Reflective Single-Side-Band-Modulating MIMO Array and Non-Absorbing Termination.M. Meng, M. Dunna, H. Yu, S. Kuo, P. Wang, D. Bharadia, и P. Mercier. ISSCC, стр. 202-204. IEEE, (2021)Understanding ESD Induced Thermal Mechanism in FinFETs Through Predictive TCAD Simulation.Z. Li, B. Zhu, A. Nath, M. Miao, A. Loiseau, Y. Li, J. Johnson, S. Mitra, и R. Gauthier. IRPS, стр. 1-4. IEEE, (2020)

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