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Modeling and Evaluation of Substrate Noise Induced by Interconnects.

, , and . DATE, page 10524-10529. IEEE Computer Society, (2003)

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Experimental analysis of substrate isolation techniques for RF-SOC integration., , and . SoCC, page 199-202. IEEE, (2009)Analysis of Body Bias and RTN-Induced Frequency Shift of Low Voltage Ring Oscillators in FDSOI Technology., , , , , , , , , and 2 other author(s). PATMOS, page 82-87. IEEE, (2018)Aging in CMOS RF Linear Power Amplifiers: Experimental Comparison and Modeling., , , , , , and . ISCAS, page 1-5. IEEE, (2019)Inductor shielding strategies to protect mmW LC-VCOs from high frequency substrate noise., , , and . Microelectron. J., 44 (5): 405-413 (2013)A low-power RF front-end for 2.5 GHz receivers., , , , , , and . ISCAS, page 976-979. IEEE, (2008)Phase noise degradation of LC-tank VCOs due to substrate noise and package coupling., , , and . ESSCIRC, page 105-108. IEEE, (2005)An Ultra Low-Voltage RF Front-end Receiver for IoT Devices., , , , and . PRIME, page 161-164. IEEE, (2022)Design of ULV ULP LNAs Exploiting FBB in FDSOI 28nm Technology., , , , and . DCIS, page 1-6. IEEE, (2019)Review of temperature sensors as monitors for RF-MMW built-in testing and self-calibration schemes., , , , , , , , , and 7 other author(s). MWSCAS, page 1081-1084. IEEE, (2014)A 250-ps Integrated Ultra-Wideband Timed Array Beamforming Receiver in 0.18 μm CMOS., , , and . ICECS, page 1-4. IEEE, (2020)