( en | de | ru )

 

Disambiguation of "Lim, Sung Kyu"

Author of the publication

copydeleteadd this publication to your clipboard
Placement-driven partitioning for congestion mitigation in monolithic 3D IC designs.

, , , and . ISPD, page 47-54. ACM, (2014)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Sung-Ki Lim

Yong-Sung Lim

Han-Sung Lim

Sung-Kyu Hong

Sung-Yeun Lim

 

Other publications of authors with the same name

Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options., , , , and . DAC, page 1189-1194. IEEE, (2021)Heterogeneous Monolithic 3D ICs: EDA Solutions, and Power, Performance, Cost Tradeoffs., and . DAC, page 925-930. IEEE, (2021)RTL-to-GDS Tool Flow and Design-for-Test Solutions for Monolithic 3D ICs., , , , , , , , , and 1 other author(s). DAC, page 101. ACM, (2019)Exploiting die-to-die thermal coupling in 3D IC placement., , and . DAC, page 741-746. ACM, (2012)Design, packaging, and architectural policy co-optimization for DC power integrity in 3D DRAM., , , , , , and . DAC, page 91:1-91:6. ACM, (2015)Fast delay estimation with buffer insertion for through-silicon-via-based 3D interconnects., and . ISQED, page 228-335. IEEE, (2012)Signal integrity analysis and optimization for 3D ICs., , and . ISQED, page 42-49. IEEE, (2011)A generic reconfigurable array specification and programming environment (GRASPER)., , , and . ECCTD, page 619-622. IEEE, (2009)A unified methodology for power supply noise reduction in modern microarchitecture design., , , and . ASP-DAC, page 611-616. IEEE, (2008)Statistical Bellman-Ford algorithm with an application to retiming., , and . ASP-DAC, page 959-964. IEEE, (2006)