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What are the actual needs of visually impaired people?, , and . Displays, (July 2023)Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators., , , , , , and . ISQED, page 60-66. IEEE, (2021)Heterogeneous 3D Integration for a RISC-V System With STT-MRAM., , , , , , , , and . IEEE Comput. Archit. Lett., 19 (1): 51-54 (2020)A PPA Study for Heterogeneous 3-D IC Options: Monolithic, Hybrid Bonding, and Microbumping., , , , and . IEEE Trans. Very Large Scale Integr. Syst., 32 (3): 401-412 (March 2024)Physical Design Challenges and Solutions for Emerging Heterogeneous 3D Integration Technologies., and . ISPD, page 127-134. ACM, (2021)A Machine Learning-Powered Tier Partitioning Methodology for Monolithic 3-D ICs., , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 41 (11): 4575-4586 (2022)From luna to solar: the evolutions of the compute-to-storage networks in Alibaba cloud., , , , , , , , , and 7 other author(s). SIGCOMM, page 753-766. ACM, (2022)The Financial Archives Management System of University Based on Computer Network Technology.. CSIA (2), volume 1147 of Advances in Intelligent Systems and Computing, page 160-167. Springer, (2020)Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture., , , , , , , , , and 1 other author(s). ISLPED, page 1-6. IEEE, (2021)INVITED: Design Automation Needs for Monolithic 3D ICs: Accomplishments and Gaps., and . DAC, page 1-4. IEEE, (2023)