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Embedded-EEPROM descrambling via laser-based techniques - A case study on AVR MCU.

S. Chef, C. Chua, J. Tay, J. Cheah, and C. Gan. FDTC, page 1-8. IEEE, (2022)

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Bevan Cheeseman

Tian Gan

Chee Yap

Lishan Gan

Gan Lu

Other publications of authors with the same name

Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution.A. Lim, C. Boothroyd, O. Yauw, B. Chylak, C. Gan, and Z. Chen. Microelectron. Reliab., (2016)Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.A. Lim, A. Chang, O. Yauw, B. Chylak, C. Gan, and Z. Chen. Microelectron. Reliab., 54 (11): 2555-2563 (2014)Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop.C. Chua, H. Ong, K. Sanchez, P. Perdu, and C. Gan. Microelectron. Reliab., (2016)A Security Assessment of Protected Execute-Only Firmware in Microcontrollers Through Selective Chemical Engraving.X. Zeng, L. Qing, S. Chef, and C. Gan. HOST, page 12-20. IEEE, (2024)Unsupervised learning for signal mapping in dynamic photon emission.S. Chef, S. Jacquir, K. Sanchez, P. Perdu, S. Binczak, and C. Gan. Microelectron. Reliab., 55 (9-10): 1564-1568 (2015)Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors.W. Sasangka, Y. Gao, C. Gan, and C. Thompson. Microelectron. Reliab., (2018)Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations.S. Alam, C. Gan, C. Thompson, and D. Troxel. Microelectron. J., 38 (4-5): 463-473 (2007)Embedded-EEPROM descrambling via laser-based techniques - A case study on AVR MCU.S. Chef, C. Chua, J. Tay, J. Cheah, and C. Gan. FDTC, page 1-8. IEEE, (2022)Copper micro and nano particles mixture for 3D interconnections application.Y. Dai, M. Ng, P. Anantha, C. Gan, and C. Tan. 3DIC, page TS8.9.1-TS8.9.5. IEEE, (2015)Characterisation of defects generated during constant current InGaN-on-silicon LED operation.R. Made, Y. Gao, G. Syaranamual, W. Sasangka, L. Zhang, X. Nguyen, Y. Tay, J. Herrin, C. Thompson, and C. Gan. Microelectron. Reliab., (2017)

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Disambiguation of "Gan, Chee Lip"

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Embedded-EEPROM descrambling via laser-based techniques - A case study on AVR MCU.

Please choose a person to relate this publication to

Bevan Cheeseman

Tian Gan

Chee Yap

Lishan Gan

Gan Lu

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Gan, Chee Lip"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Embedded-EEPROM descrambling via laser-based techniques - A case study on AVR MCU.

Please choose a person to relate this publication to

Bevan Cheeseman

Tian Gan

Chee Yap

Lishan Gan

Gan Lu

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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Embedded-EEPROM descrambling via laser-based techniques - A case study on AVR MCU.