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Design issues and considerations for low-cost 3D TSV IC technology.

, , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , и . ISSCC, стр. 148-149. IEEE, (2010)

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Thijs Willaert

Thijs Besems

Gerard Philip Thijsse

Mirelle Thijsen

Thijs Willaert

 

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RF ESD protection strategies - the design and performance trade-off challenges., , , , , , , , , и 5 other автор(ы). CICC, стр. 489-496. IEEE, (2005)Low-cost feedback-enabled LNAs in 45nm CMOS., , , , и . ESSCIRC, стр. 100-103. IEEE, (2009)A 5 GHz fully integrated ESD-protected low-noise amplifier in 90 nm RF CMOS., , , , , , , , , и . ESSCIRC, стр. 291-294. IEEE, (2004)A low-power 57-to-66GHz transceiver in 40nm LP CMOS with -17dB EVM at 7Gb/s., , , , , , , , , и 2 other автор(ы). ISSCC, стр. 268-270. IEEE, (2012)50-to-67GHz ESD-protected power amplifiers in digital 45nm LP CMOS., , , , и . ISSCC, стр. 382-383. IEEE, (2009)A 5-GHz fully integrated ESD-protected low-noise amplifier in 90-nm RF CMOS., , , , , , , , , и . IEEE J. Solid State Circuits, 40 (7): 1434-1442 (2005)Band Relevance Study of SWIR Hyperspectral Imaging for Material Recycling and Reuse., , и . WHISPERS, стр. 1-5. IEEE, (2023)Advanced SCR ESD protection circuits for CMOS/SOI nanotechnologies., , , , и . CICC, стр. 481-488. IEEE, (2005)Inductor-based ESD protection under CDM-like ESD stress conditions for RF applications., , , , , , , и . CICC, стр. 49-52. IEEE, (2008)Advanced Planar Bulk and Multigate CMOS Technology: Analog-Circuit Benchmarking up to mm-Wave Frequencies., , , , , , , , , и 5 other автор(ы). ISSCC, стр. 528-529. IEEE, (2008)