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Design issues and considerations for low-cost 3D TSV IC technology.

G. der Plas, P. Limaye, A. Mercha, H. Oprins, C. Torregiani, S. Thijs, D. Linten, M. Stucchi, G. Katti, D. Velenis, D. Shinichi, V. Cherman, B. Vandevelde, V. Simons, I. Wolf, R. Labie, D. Perry, S. Bronckers, N. Minas, M. Cupac, W. Ruythooren, J. Olmen, A. Phommahaxay, M. de Potter de ten Broeck, A. Opdebeeck, M. Rakowski, B. Wachter, M. Dehan, M. Nelis, R. Agarwal, W. Dehaene, Y. Travaly, P. Marchal, and E. Beyne. ISSCC, page 148-149. IEEE, (2010)

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Herman Wehling

Herman Keil

Herman Pratikto

Herman Vloed

Herman Hindermayr

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Thermal experimental and modeling analysis of high power 3D packages.H. Oprins, V. Cherman, G. der Plas, F. Maggioni, J. Vos, and E. Beyne. ICICDT, page 1-4. IEEE, (2015)Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications.K. Croes, V. Simons, S. Beyne, V. Cherman, H. Oprins, M. Stucchi, P. Absil, A. Glabman, and E. Wilcox. IRPS, page 1-4. IEEE, (2019)Fine grain thermal modeling and experimental validation of 3D-ICs.H. Oprins, A. Srinivasan, M. Cupák, V. Cherman, C. Torregiani, M. Stucchi, G. der Plas, P. Marchal, B. Vandevelde, and E. Cheng. Microelectron. J., 42 (4): 572-578 (2011)New fast distributed thermal model for analysis of GaN based power devices.V. Sodan, F. Maggioni, H. Oprins, S. Stoffels, M. Baelmans, and I. Wolf. ESSDERC, page 172-175. IEEE, (2016)Modeling and Control of Electrowetting Induced Droplet Motion.H. Oprins, B. Vandevelde, and M. Baelmans. Micromachines, 3 (1): 150-167 (2012)Coupled Dynamic Thermo-Optical Analysis and Compact Modelling of Self-Heating in Ring Modulator.D. Coenen, M. Kim, H. Oprins, I. Wolf, Y. Ban, and J. Campenhout. PSC, page 1-3. IEEE, (2023)DRAM-on-logic Stack - Calibrated thermal and mechanical models integrated into PathFinding flow.D. Milojevic, H. Oprins, J. Ryckaert, P. Marchal, and G. der Plas. CICC, page 1-4. IEEE, (2011)Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.G. der Plas, P. Limaye, I. Loi, A. Mercha, H. Oprins, C. Torregiani, S. Thijs, D. Linten, M. Stucchi, G. Katti and 27 other author(s). IEEE J. Solid State Circuits, 46 (1): 293-307 (2011)Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits.D. Coenen, H. Oprins, R. Degraeve, and I. Wolf. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 42 (7): 2264-2275 (July 2023)Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs).S. Mishra, S. Venkateswarlu, B. Vermeersch, M. Brunion, M. Lofrano, D. Abdi, H. Oprins, D. Biswas, O. Zografos, G. Hiblot and 6 other author(s). IRPS, page 1-7. IEEE, (2023)

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Disambiguation of "Oprins, Herman"

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Design issues and considerations for low-cost 3D TSV IC technology.

Please choose a person to relate this publication to

Herman Wehling

Herman Keil

Herman Pratikto

Herman Vloed

Herman Hindermayr

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Oprins, Herman"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Design issues and considerations for low-cost 3D TSV IC technology.

Please choose a person to relate this publication to

Herman Wehling

Herman Keil

Herman Pratikto

Herman Vloed

Herman Hindermayr

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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MSOffice XML

Design issues and considerations for low-cost 3D TSV IC technology.