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Reliability-aware Co-synthesis for Embedded Systems., , , , и . VLSI Signal Processing, 49 (1): 87-99 (2007)Crosstalk-Aware Energy Efficient Encoding for Instruction Bus through Code Compression., и . SoCC, стр. 193-196. IEEE, (2006)Leakage Optimized DECAP Design for FPGAs., , , , и . APCCAS, стр. 960-963. IEEE, (2006)Exploring memory controller configurations for many-core systems with 3D stacked DRAMs., , , и . ISQED, стр. 565-570. IEEE, (2015)Understanding the trade-offs in multi-level cell ReRAM memory design., , , , и . DAC, стр. 108:1-108:6. ACM, (2013)Making B+-tree efficient in PCM-based main memory., , и . ISLPED, стр. 69-74. ACM, (2014)Technology, CAD tools, and designs for emerging 3D integration technology., , и . ACM Great Lakes Symposium on VLSI, стр. 1-2. ACM, (2008)Investigation and comparison of thermal distribution in synchronous and asynchronous 3D ICs., , , , , и . 3DIC, стр. 1-5. IEEE, (2009)Arithmetic unit design using 180nm TSV-based 3D stacking technology., , , , , , и . 3DIC, стр. 1-4. IEEE, (2009)Thermal-aware power network design for IR drop reduction in 3D ICs., , , , , , и . ASP-DAC, стр. 47-52. IEEE, (2012)