Author of the publication

Pulse-Vanishing Test for Interposers Wires in 2.5-D IC.

, , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 33 (8): 1258-1268 (2014)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Online slack-time binning for IO-registered die-to-die interconnects., , , , , and . ITC, page 1-8. IEEE, (2016)A versatile paradigm for scan chain diagnosis of complex faults using signal processing techniques., , and . ACM Trans. Design Autom. Electr. Syst., 13 (1): 9:1-9:27 (2008)A Folded Locking Scheme for the Long-Range Delay Block in a Wide-Range DLL., and . ISOCC, page 90-91. IEEE, (2018)Small delay testing for TSVs in 3-D ICs., , , , , , and . DAC, page 1031-1036. ACM, (2012)Robust paradigm for diagnosing hold-time faults in scan chains., , and . IET Comput. Digit. Tech., 1 (6): 706-715 (2007)Resilient Self-VDD-Tuning Scheme With Speed-Margining for Low-Power SRAM., , and . IEEE J. Solid State Circuits, 44 (10): 2817-2823 (2009)Oscillation-Based Prebond TSV Test., , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 32 (9): 1440-1444 (2013)Parametric Delay Test of Post-Bond Through-Silicon Vias in 3-D ICs via Variable Output Thresholding Analysis., , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 32 (5): 737-747 (2013)Circuit and Methodology for Testing Small Delay Faults in the Clock Network., , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 37 (10): 2087-2097 (2018)Pulse-Vanishing Test for Interposers Wires in 2.5-D IC., , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 33 (8): 1258-1268 (2014)