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Smart Cut™ technology: from Substrate Enginnering to Advanced 3D Integration.

, , and . ICICDT, page 81-83. IEEE, (2022)

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Investigation of Random Telegraph Noise in Advanced Silicon-On-Insulator N-FETs: The Impact of Back Bias, Strain, and Hot Carrier Stress., , , , , , , , , and 2 other author(s). ICICDT, page 116-119. IEEE, (2023)Performance and reliability of strained SOI transistors for advanced planar FDSOI technology., , , , , , , , , and . IRPS, page 2. IEEE, (2015)Low Temperature SmartCutTM enables High Density 3D SoC Applications., , and . ICICDT, page 1-2. IEEE, (2019)Superior performance and Hot Carrier reliability of Strained FDSOI nMOSFETs for advanced CMOS technology nodes., , , , , , , , , and 1 other author(s). ESSDERC, page 226-229. IEEE, (2014)Smart Cut™ technology: from Substrate Enginnering to Advanced 3D Integration., , and . ICICDT, page 81-83. IEEE, (2022)Demonstration of 3D sequential FD-SOI on CMOS FinFET stacking featuring low temperature Si layer transfer and top tier device fabrication with tier interconnections., , , , , , , , , and 15 other author(s). VLSI Technology and Circuits, page 330-331. IEEE, (2022)