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s HBM Base Die Receiver Using a 45° Strobe Phase for Energy-Efficient Skew Compensation.

S. Lee, H. Ko, J. Chae, S. Shin, J. Yun, D. Jeong, и S. Kim. IEEE Trans. Circuits Syst. II Express Briefs, 67-II (10): 1735-1739 (2020)

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Dong-Shin Shin

Jeonghun Shin

Kirche als Weltforum: zum Dialogverständnis in kirchlichen Dokumenten seit dem Zweiten Vatikanischen KonzilJ. Shin. Uni München, (2009)

Hyeseon Shin

Koo Cheul Shin

Hwa-Ja Shin

Другие публикации лиц с тем же именем

22.6 A 0.8-to-2.3GHz Quadrature Error Corrector with Correctable Error Range of 101.6ps Using Minimum Total Delay Tracking and Asynchronous Calibration On-Off Scheme for DRAM Interface.S. Shin, H. Ko, S. Jang, D. Kim, и D. Jeong. ISSCC, стр. 340-342. IEEE, (2020)A PVT Variation-Robust All-Digital Injection-Locked Clock Multiplier With Real-Time Offset Tracking Using Time-Division Dual Calibration.M. Choo, S. Kim, H. Ko, S. Cho, K. Park, J. Lee, S. Shin, H. Chi, и D. Jeong. IEEE J. Solid State Circuits, 56 (8): 2525-2538 (2021)6.7 An 8Gb/s/µm FFE-Combined Crosstalk-Cancellation Scheme for HBM on Silicon Interposer with 3D-Staggered Channels.H. Ko, S. Shin, J. Oh, K. Park, и D. Jeong. ISSCC, стр. 128-130. IEEE, (2020)29.7 A 2.5GHz injection-locked ADPLL with 197fsrms integrated jitter and -65dBc reference spur using time-division dual calibration.S. Kim, H. Ko, S. Cho, J. Lee, S. Shin, M. Choo, H. Chi, и D. Jeong. ISSCC, стр. 494-495. IEEE, (2017)0.41-pJ/b/dB Asymmetric Simultaneous Bidirectional Transceivers With PAM-4 Forward and PAM-2 Back Channels for 5-m Automotive Camera Link.Y. Lee, W. Lee, M. Shim, S. Shin, W. Choi, и D. Jeong. VLSI Technology and Circuits, стр. 30-31. IEEE, (2022)A 370-fJ/b, 0.0056 mm2/DQ, 4.8-Gb/s DQ Receiver for HBM3 with a Baud-Rate Self-Tracking Loop.H. Ko, S. Shin, C. Kye, S. Lee, J. Yun, H. Jung, D. Lee, S. Kim, и D. Jeong. VLSI Circuits, стр. 94-. IEEE, (2019)A 0.83-pJ/Bit 6.4-Gb/s HBM Base Die Receiver Using a 45° Strobe Phase for Energy-Efficient Skew Compensation.S. Lee, H. Ko, J. Chae, S. Shin, J. Yun, D. Jeong, и S. Kim. IEEE Trans. Circuits Syst. II Express Briefs, 67-II (10): 1735-1739 (2020)

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