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Breaking the 3D IC power delivery wall., and . ACSCC, page 741-746. IEEE, (2012)Breaking the power delivery wall using voltage stacking., and . ACM Great Lakes Symposium on VLSI, page 51-54. ACM, (2012)Exploring security threats and solutions Techniques for Internet of Things (IoT): from vulnerabilities to vigilance., and . Frontiers Artif. Intell., (2024)A cross-layer design exploration of charge-recycled power-delivery in many-layer 3d-IC., , , , , and . DAC, page 133:1-133:6. ACM, (2015)Sustainable task offloading decision using genetic algorithm in sensor mobile edge computing., and . J. King Saud Univ. Comput. Inf. Sci., 34 (4): 1552-1568 (2022)8.6 Enabling wide autonomous DVFS in a 22nm graphics execution core using a digitally controlled hybrid LDO/switched-capacitor VR with fast droop mitigation., , , , , , , , , and 2 other author(s). ISSCC, page 1-3. IEEE, (2015)Predict; Don't React for Enabling Efficient Fine-Grain DVFS in GPUs., , , , and . ASPLOS (4), page 253-267. ACM, (2023)Transient voltage noise in charge-recycled power delivery networks for many-layer 3D-IC., , , , , and . ISLPED, page 152-158. IEEE, (2015)Pre-RTL Voltage and Power Optimization for Low-Cost, Thermally Challenged Multicore Chips., , , , , and . ICCD, page 597-600. IEEE Computer Society, (2017)A multi-output on-chip switched-capacitor DC-DC converter for near- and sub-threshold power modes., , , , and . ISCAS, page 1632-1635. IEEE, (2014)