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A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network.

, , , , and . SLIP, page 1-7. IEEE, (2021)

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Impact of via geometry and line extension on via-electromigration in nano-interconnects., , , , and . IRPS, page 1-4. IEEE, (2023)Challenges for Interconnect Reliability: From Element to System Level., , , , and . ISPD, page 106. ACM, (2023)Variation-Aware Physics-Based Electromigration Modeling and Experimental Calibration for VLSI Interconnects., , , , , , , and . IRPS, page 1-6. IEEE, (2019)Assessment of critical Co electromigration parameters., , , , , , , , and . IRPS, page 8. IEEE, (2022)Determination of the influence of stent strut thickness using the finite element method: implications for vascular injury and in-stent restenosis., and . Medical Biol. Eng. Comput., 47 (4): 385-393 (2009)Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation., , , , , and . Microelectron. Reliab., (2016)System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents., , , , and . IRPS, page 1-7. IEEE, (2022)Electromigration limits of copper nano-interconnects., , , and . IRPS, page 1-6. IEEE, (2021)Stress mitigation of 3D-stacking/packaging induced stresses., , , , , , , , and . IRPS, page 4. IEEE, (2018)A pragmatic network-aware paradigm for system-level electromigration predictions at scale., , , and . IRPS, page 1-6. IEEE, (2023)