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Performance and Reliability of Nanosheet Oxide Semiconductor FETs with ALD-Grown InGaO for 3D Integration (Invited)., , , , , , , , , и . IRPS, стр. 9. IEEE, (2024)Quarter Video Graphics Array Full-Digital Image Sensing with Wide Dynamic Range and Linear Output Using Pixel-Wise 3D Integration., , , , , , , , , и 1 other автор(ы). ISCAS, стр. 1-4. IEEE, (2018)Comprehensive Understanding of Negative Capacitance FET From the Perspective of Transient Ferroelectric Model., , и . ASICON, стр. 1-4. IEEE, (2019)Monolithic 3D Integration of Oxide Semiconductor FETs and Memory Devices for AI Acceleration (Invited).. IRPS, стр. 1-6. IEEE, (2022)3-Layer stacked pixel-parallel CMOS image sensors using hybrid bonding of SOI wafers., , , , , , , , и . Imaging Sensors and Systems, стр. 1-4. Society for Imaging Science and Technology, (2022)Scalability Study on Ferroelectric-HfO2 Tunnel Junction Memory Based on Non-equilibrium Green Function Method., , , , и . NVMTS, стр. 1-5. IEEE, (2019)Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers., , , , , , , , и . 3DIC, стр. TS9.2.1-TS9.2.4. IEEE, (2015)Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers., , , , , , , , , и 2 other автор(ы). 3DIC, стр. 1-4. IEEE, (2019)Parallel nonvolatile programming of power-up states of SRAM cells., , , и . ASICON, стр. 418-421. IEEE, (2017)A study on the digitization of audio signals for video tape recorder., , , , , и . ICASSP, стр. 29-32. IEEE, (1986)