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A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibration Scheme and Machine-Learning-Based Layout Optimization.

M. Park, H. Cho, T. Yun, S. Byeon, Y. Koo, S. Yoon, D. Lee, S. Choi, J. Park, J. Lee, K. Cho, J. Moon, B. Yoon, Y. Park, S. Oh, C. Lee, T. Kim, S. Lee, H. Kim, Y. Ju, S. Lim, S. Baek, K. Lee, S. Lee, W. We, S. Kim, Y. Choi, S. Lee, S. Yang, G. Lee, I. Kim, Y. Jeon, J. Park, J. Yun, C. Park, S. Kim, S. Kim, D. Lee, S. Oh, T. Hwang, J. Shin, Y. Lee, H. Kim, J. Lee, Y. Hur, S. Lee, J. Jang, J. Chun, and J. Cho. ISSCC, page 444-446. IEEE, (2022)

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Andreas Choi

Youngmi Choi

Bongkyung Choi

Carmen Choi

Chiwon Choi

Other publications of authors with the same name

Detecting Common Modules in Java Packages Based on Static Object Trace Birthmark.H. Park, H. il Lim, S. Choi, and T. Han. Comput. J., 54 (1): 108-124 (2011)A Static Java Birthmark Based on Control Flow Edges.H. il Lim, H. Park, S. Choi, and T. Han. COMPSAC (1), page 413-420. IEEE Computer Society, (2009)A Human-in-the-Loop Approach to Malware Author Classification.E. Kim, S. Park, D. Chae, S. Choi, and S. Kim. CIKM, page 3289-3292. ACM, (2020)MU-MIMO User Grouping for WLANs supporting Indoor VR Applications.K. Shin, S. Choi, and H. Kim. ICTC, page 969-971. IEEE, (2020)22.3 A 128Gb 8-High 512GB/s HBM2E DRAM with a Pseudo Quarter Bank Structure, Power Dispersion and an Instruction-Based At-Speed PMBIST.D. Lee, H. Cho, J. Kim, Y. Ku, S. Oh, C. Kim, H. Kim, W. Lee, T. Kim, T. Yun and 27 other author(s). ISSCC, page 334-336. IEEE, (2020)Flit Scheduling for Cut-Through Switching: Towards Near-Zero End-to-End Latency.K. Shin, S. Choi, and H. Kim. IEEE Access, (2019)End-to-End Latency Prediction for General-Topology Cut-Through Switching Networks.S. Choi, K. Shin, and H. Kim. IEEE Access, (2020)A Static Birthmark of Binary Executables Based on API Call Structure.S. Choi, H. Park, H. il Lim, and T. Han. ASIAN, volume 4846 of Lecture Notes in Computer Science, page 2-16. Springer, (2007)Efficient SVM Based Packer Identification with Binary Diffing Measures.Y. Kim, J. Paik, S. Choi, and E. Cho. COMPSAC (1), page 795-800. IEEE, (2019)A 192-Gb 12-High 896-GB/s HBM3 DRAM With a TSV Auto-Calibration Scheme and Machine-Learning-Based Layout Optimization.M. Park, J. Lee, K. Cho, J. Park, J. Moon, S. Lee, T. Kim, S. Oh, S. Choi, Y. Choi and 29 other author(s). IEEE J. Solid State Circuits, 58 (1): 256-269 (2023)

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Disambiguation of "Choi, Seokwoo"

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A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibration Scheme and Machine-Learning-Based Layout Optimization.

Please choose a person to relate this publication to

Andreas Choi

Youngmi Choi

Bongkyung Choi

Carmen Choi

Chiwon Choi

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Choi, Seokwoo"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibration Scheme and Machine-Learning-Based Layout Optimization.

Please choose a person to relate this publication to

Andreas Choi

Youngmi Choi

Bongkyung Choi

Carmen Choi

Chiwon Choi

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibration Scheme and Machine-Learning-Based Layout Optimization.