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A 192-Gb 12-High 896-GB/s HBM3 DRAM With a TSV Auto-Calibration Scheme and Machine-Learning-Based Layout Optimization.

, , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , and . IEEE J. Solid State Circuits, 58 (1): 256-269 (2023)

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An analysis of magnetic resonance coupling effects on wireless power transfer by coil inductance and placement., , , , and . IEEE Trans. Consumer Electronics, 60 (2): 203-209 (2014)13.4 A 48GB 16-High 1280GB/s HBM3E DRAM with All-Around Power TSV and a 6-Phase RDQS Scheme for TSV Area Optimization., , , , , , , , , and 38 other author(s). ISSCC, page 238-240. IEEE, (2024)A 192-Gb 12-High 896-GB/s HBM3 DRAM With a TSV Auto-Calibration Scheme and Machine-Learning-Based Layout Optimization., , , , , , , , , and 29 other author(s). IEEE J. Solid State Circuits, 58 (1): 256-269 (2023)Design of a 169% locking-range frequency divider with programmable input sensitivity., , , , and . ICCE, page 222-223. IEEE, (2015)A 12-Bit 500-MS/s Current Steering CMOS DAC for High-Speed PLC Modems., , and . Journal of Circuits, Systems, and Computers, 25 (10): 1650122:1-1650122:16 (2016)Design of low-power, fast-transient-response, capacitor-less low-dropout regulator for mobile applications., , and . IEICE Electron. Express, 13 (23): 20160882 (2016)Optimization of resonant inductive links for wireless power transfer., , , , , and . ICCE, page 249-250. IEEE, (2016)A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibration Scheme and Machine-Learning-Based Layout Optimization., , , , , , , , , and 39 other author(s). ISSCC, page 444-446. IEEE, (2022)Design of a 5-W power receiver for 6.78 MHz resonant wireless power transfer system with power supply switching circuit., , , , and . IEEE Trans. Consumer Electronics, 62 (4): 349-354 (2016)Investigation of wireless power transfer in multi-coil environment., , , , , and . ICCE, page 311-312. IEEE, (2014)