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Online slack-time binning for IO-registered die-to-die interconnects., , , , , и . ITC, стр. 1-8. IEEE, (2016)Small delay testing for TSVs in 3-D ICs., , , , , , и . DAC, стр. 1031-1036. ACM, (2012)Scan based speed-path debug for a microprocessor., , , , , , и . European Test Symposium, стр. 207-212. IEEE Computer Society, (2010)A Low Complexity Transmitter Architecture and Its Application to PAPR Reduction in SFBC MIMO-OFDM Systems., , и . ICC, стр. 1-5. IEEE, (2010)Oscillation-Based Prebond TSV Test., , , , и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 32 (9): 1440-1444 (2013)Improving the Resolution of Single-Delay-Fault Diagnosis., , , и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 27 (5): 932-945 (2008)Circuit and Methodology for Testing Small Delay Faults in the Clock Network., , , , и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 37 (10): 2087-2097 (2018)Pulse-Vanishing Test for Interposers Wires in 2.5-D IC., , , и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 33 (8): 1258-1268 (2014)Analysis and methodology for multiple-fault diagnosis., , , и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 25 (3): 558-575 (2006)Parametric Delay Test of Post-Bond Through-Silicon Vias in 3-D ICs via Variable Output Thresholding Analysis., , , , , , и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 32 (5): 737-747 (2013)