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s Interface.

M. Kim, S. Yun, J. Park, H. Park, J. Lee, Y. Kim, D. Na, S. Choi, Y. Song, J. Lee, H. Yoon, K. Lee, B. Jeong, S. Kim, J. Park, C. Lee, J. Lee, J. Lee, J. Chun, J. Jang, Y. Yang, S. Moon, M. Choi, W. Kim, J. Kim, S. Yoon, P. Kwak, M. Lee, R. Song, S. Kim, C. Yoon, D. Kang, J. Lee, and J. Song. ISSCC, page 136-137. IEEE, (2022)

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Song Song

Jai Prakash

Young-Hyuk Joo

Hyuk-Cheol Kwon

Other publications of authors with the same name

Machine Learning for Product Engineering in NAND Flash Memory.J. Kim, E. Kim, J. Choe, K. Song, E. Kim, and J. Song. ICEIC, page 1-2. IEEE, (2022)Novel Electrical Detection Method for Random Defects on Peripheral Circuits in NAND Flash Memory.B. Nam, Y. Choi, S. Hong, K. Dong, W. Jung, S. Park, S. Lee, D. Jung, B. Kim, E. Kim and 3 other author(s). IRPS, page 40-1. IEEE, (2022)Issues and Key Technologies for Next Generation 3D NAND.C. Yoon, H. Kim, S. Lee, J. Lee, and J. Song. ICEIC, page 1-4. IEEE, (2021)A 512Gb 3b/Cell 7th -Generation 3D-NAND Flash Memory with 184MB/s Write Throughput and 2.0Gb/s Interface.J. Cho, D. Kang, J. Park, S. Nam, J. Song, B. Jung, J. Lyu, H. Lee, W. Kim, H. Jeon and 34 other author(s). ISSCC, page 426-428. IEEE, (2021)Cell Operation Technologies to Overcome Scale-down Issues in 3D NAND Flash Memory.W. Kim, D. Byeon, S. Joe, J. Lee, and J. Song. ICEIC, page 298-299. IEEE, (2022)Development of 7th generation 3D VNAND Flash Product with COP structure for Growing Demand in Storage Market.J. Lim, S. Chung, D. Ko, S. Sung, K. Noh, S. Ahn, and J. Song. ICEIC, page 1-4. IEEE, (2022)A 1Tb 3b/Cell 8th-Generation 3D-NAND Flash Memory with 164MB/s Write Throughput and a 2.4Gb/s Interface.M. Kim, S. Yun, J. Park, H. Park, J. Lee, Y. Kim, D. Na, S. Choi, Y. Song, J. Lee and 24 other author(s). ISSCC, page 136-137. IEEE, (2022)Electric Field Impact on Lateral Charge Diffusivity in Charge Trapping 3D NAND Flash Memory.J. Lee, J. Seo, J. Nam, Y. Kim, K. Song, J. Song, and W. Choi. IRPS, page 29-1. IEEE, (2022)A 1.8 Gb/s/pin 16Tb NAND Flash Memory Multi-Chip Package with F-Chip of Toggle 4.0 Specification for High Performance and High Capacity Storage Systems.J. Lee, D. Na, A. Kavala, H. Cho, J. Lee, M. Yang, E. Song, T. Kim, S. Lee, D. Jang and 16 other author(s). VLSI Circuits, page 1-2. IEEE, (2020)A Hybrid ZQ Calibration Design for High-Density Flash Memory Toggle 5.0 High-speed Interface.T. Kim, A. Kavala, H. Kang, Y. Jo, J. Park, K. Kang, B. Chun, D. Shin, D. Jang, B. Jeong and 3 other author(s). A-SSCC, page 1-2. IEEE, (2021)

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Disambiguation of "Song, Jai Hyuk"

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A 1Tb 3b/Cell 8th-Generation 3D-NAND Flash Memory with 164MB/s Write Throughput and a 2.4Gb/s Interface.

Please choose a person to relate this publication to

Song Song

Song Song

Jai Prakash

Young-Hyuk Joo

Hyuk-Cheol Kwon

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Song, Jai Hyuk"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML A 1Tb 3b/Cell 8th-Generation 3D-NAND Flash Memory with 164MB/s Write Throughput and a 2.4Gb/s Interface.

Please choose a person to relate this publication to

Song Song

Song Song

Jai Prakash

Young-Hyuk Joo

Hyuk-Cheol Kwon

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

A 1Tb 3b/Cell 8th-Generation 3D-NAND Flash Memory with 164MB/s Write Throughput and a 2.4Gb/s Interface.