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15.1 A 5nm 135Mb SRAM in EUV and High-Mobility-Channel FinFET Technology with Metal Coupling and Charge-Sharing Write-Assist Circuitry Schemes for High-Density and Low-VMIN Applications.

J. Chang, Y. Chen, G. Chan, H. Cheng, P. Wang, Y. Lin, H. Fujiwara, R. Lee, H. Liao, P. Wang, G. Yeap, and Q. Li. ISSCC, page 238-240. IEEE, (2020)

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Alexander Gary

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Other publications of authors with the same name

MixNStream: multi-source video distribution with stream mixers.P. Yuen, and G. Chan. AVSTP2P@MM, page 77-82. ACM, (2010)A 3nm 256Mb SRAM in FinFET Technology with New Array Banking Architecture and Write-Assist Circuitry Scheme for High-Density and Low-VMIN Applications.J. Chang, Y. Chen, G. Chan, K. Lin, P. Wang, Y. Lin, S. Chen, P. Lin, C. Wu, C. Lin and 8 other author(s). VLSI Technology and Circuits, page 1-2. IEEE, (2023)A 135.6Tbps/W 2R2W SRAM with 12T Logic Bit-cell with Vmin Down to 335mV Targeted for Machine-Learning Applications in 6nm FinFET CMOS Technology.N. Akkaya, G. Chan, H. Liao, Y. Wang, and J. Chang. VLSI Technology and Circuits, page 110-111. IEEE, (2022)Proceedings of The 28th International Teletraffic Congress 2016 (ITC 28)T. Hoßfeld, G. Chan, B. Mark, and A. Timm-Giel. ITC, IEEE, ACM, Würzburg, Germany, (September 2016)15.1 A 5nm 135Mb SRAM in EUV and High-Mobility-Channel FinFET Technology with Metal Coupling and Charge-Sharing Write-Assist Circuitry Schemes for High-Density and Low-VMIN Applications.J. Chang, Y. Chen, G. Chan, H. Cheng, P. Wang, Y. Lin, H. Fujiwara, R. Lee, H. Liao, P. Wang and 2 other author(s). ISSCC, page 238-240. IEEE, (2020)# Prefaces to the ITC28T. Hoßfeld, B. Mark, G. Chan, and A. Timm-Giel. 28th International Teletraffic Congress (ITC 28), Würzburg, Germany, (September 2016)Unified framework for multifactor authentication.C. Pavlovski, C. Warwar, B. Paskin, and G. Chan. ICT, page 209-213. IEEE, (2015)# ITC28 ProceedingsT. Hoßfeld, B. Mark, G. Chan, and A. Timm-Giel. 28th International Teletraffic Congress (ITC 28), Würzburg, Germany, (September 2016)A visual logic specification of flexible manufacturing systems.H. Chau, and K. Chan. SEKE, page 438-445. Knowledge Systems Institute, (1994)Visual Language for Behavioral Specifications of Reactive Systems.K. Chan, and H. Chau. ICCL, page 200-210. IEEE Computer Society, (1994)

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Disambiguation of "Chan, Gary"